Huawei Debuts 7.2Tbps Optical Module for AI Infrastructure

Huawei Technologies has introduced a high-speed optical module aimed at removing bottlenecks in artificial intelligence infrastructure, positioning the company early in the effort to establish standards for next-generation data center connectivity.

The Shenzhen-based technology company demonstrated what it describes as the industry’s first 7.2-terabit-per-second (Tbps) near-packaged optics (NPO) product at the China International Optoelectronic Exposition (CIOE) in Shenzhen earlier this week.

This technology replaces conventional copper wiring with light-based signals to transmit large volumes of data between AI processors at higher speeds and reduced power consumption compared to existing systems.

As AI clusters expand to include thousands of interconnected processors, traditional copper connections are reaching physical limits in bandwidth, transmission distance, and power efficiency. NPO addresses this by placing optical components closer to network switching chips, shortening electrical pathways and reducing signal loss and power consumption.

Huawei’s module integrates 36 channels operating at 200 gigabits per second each, delivering an aggregate bandwidth of 7.2Tbps, according to Man Jiangwei, director of Huawei’s advanced optoelectronics laboratory.

This capacity places the module among a new generation of high-density optical interconnect products emerging for AI systems, alongside 6.4Tbps optical engines developed for co-packaged optics by US chipmaker Broadcom.

“We have already fully entered the product development stage,” Man stated in an interview with the South China Morning Post on Thursday. “Once the entire supply chain and manufacturing system is established, I believe it will not be long before we can proceed rapidly into volume production.”

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