Nearfield Instruments Raises $380 Million Amid AI Chip‑Making Boom
By Stephen Nellis
Funding Details and Company Valuation
SAN FRANCISCO, June 22 – Nearfield Instruments, a Dutch firm whose precision measurement tools are essential for advanced semiconductor manufacturing, announced it has raised $380 million in new funding. The investment values the company at approximately $1.6 billion.
Technology Behind Nearfield Instruments
Atomic Force Microscopes Explained
Nearfield builds atomic‑force microscopes (AFMs) capable of measuring features on chips that are only a few atoms tall. The devices work by dragging a fine probe across a chip’s surface, much like a needle traverses a vinyl record.
Role in Semiconductor Metrology
These measurements are taken throughout the hundreds of fabrication steps that bring a chip from design to final product, ensuring process consistency in the field known as semiconductor metrology. The market is currently dominated by KLA Corp., but Nearfield’s solutions offer a compelling alternative.
Expansion Plans Amid AI Chip‑Making Boom
Use of Funds and Growth Strategy
Co‑founder and CEO Hamed Sadeghian said the round will be used to expand manufacturing capacity and strengthen customer support as demand for AI‑enabled chips accelerates.
Customer Base and Market Demand
While Sadeghian did not disclose specific clients, he noted that the company’s tools are already deployed by leading chipmakers. “We have significant demand for our systems, and we want to meet it by boosting production line productivity, expanding capacity, and reducing lead times,” he said.
Investors and Funding Round Participants
Lead Investors
The round was led by Fidelity Management & Research Company, with participation from Temasek, Innovation Industries, M&G, Invest‑NL and Walden Catalyst Ventures, a venture firm co‑founded by Intel CEO Lip‑Bu Tan.
New and Existing Investors
Qatar Investment Authority joined as a new investor, while existing backers TNO Ventures and ING also contributed to the financing.
Reporting and Editorial Credits
(Reporting by Stephen Nellis in San Francisco; Editing by Varun H K)
