South Korea’s SK Hynix’s more than $4 billion construction project includes an advanced chip packaging facility as well as a research and development complex in West Lafayette, Indiana, which is home to Purdue University. (Photo by Yifan Yu)
YIFAN YU
August 28, 2026 00:31 JST
WEST LAFAYETTE, Indiana — South Korean semiconductor leader SK Hynix officially broke ground on Thursday at its first U.S. facility dedicated to the production of high-bandwidth memory (HBM) chips. The massive investment represents a strategic expansion of advanced chip packaging capabilities within the United States, a critical development underpinning the global rapid buildout of artificial intelligence infrastructure. The new facility, located in West Lafayette near Purdue University, will also house a state-of-the-art research and development center, bolstering the region’s academic-industrial collaboration.
